Direct-to-chip cooling
Direct-to-chip cooling uses cold plates attached to processors or accelerators, with coolant loops carrying heat away from the chips. It can support high-density racks but adds facility-water, leak-management, redundancy, and serviceability considerations.
Read definition →Feasibility period
Feasibility period is a negotiated diligence window focused on whether the project can be developed as intended. It may overlap with or be distinct from a due diligence period and should be long enough for utility and entitlement checkpoints.
Read definition →Amps
Ampere is the unit of current. Amps are useful for rack, branch-circuit, feeder, and switchgear sizing, but the formula changes between DC, single-phase AC, and three-phase AC.
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